Technology and manufacture of integrated circuits
The technology and manufacture of integrated circuits (ICs) involve creating miniature electronic circuits that combine numerous components—such as transistors, resistors, capacitors, and diodes—on a single semiconductor substrate, usually silicon.
The process begins with the preparation of a silicon wafer, followed by several key steps:
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Oxidation – forming a layer of silicon dioxide to protect and insulate the surface.
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Photolithography – using light and masks to define the patterns of the circuit.
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Etching – removing unwanted material to create the desired structures.
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Doping – introducing impurities to modify the electrical properties of silicon.
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Deposition and metallization – adding layers of metal to create electrical connections between components.
After fabrication, the wafer is tested, cut into individual chips, and encapsulated (packaged) to protect it and allow connection to external circuits.